ErikStenger
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SEOUL -- Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has just made the initial shipment of the world’s first and smallest high-density memory modules based on 2-gigabit (Gb), 50 nanometer (nm)-class DDR3.
Samsung is shipping 18 configurations of its high-density, high-performance DDR3-based modules, which are designed for servers. They include a 16-gigabyte (GB) registered inline memory module (RIMM) and an 8GB RDIMM (registered dual inline memory module). Last September, a 50nm-class 2Gb DDR3 was introduced for PC applications.
The 16GB high density module operates at 1066 Megabits per second (Mbps), which allows 192GB of total memory density for a 2-socket CPU server system. Samsung also is the first to offer 16GB RDIMMs operating at 1.35 volts, providing around 20 percent savings in power consumption over 1.5V DDR3 solutions.
In addition, the 16GB RDIMM features a dual-die package configuration, which is more efficient in cost and performance over the widely discussed quad-die configuration.
Samsung is shipping 18 configurations of its high-density, high-performance DDR3-based modules, which are designed for servers. They include a 16-gigabyte (GB) registered inline memory module (RIMM) and an 8GB RDIMM (registered dual inline memory module). Last September, a 50nm-class 2Gb DDR3 was introduced for PC applications.
The 16GB high density module operates at 1066 Megabits per second (Mbps), which allows 192GB of total memory density for a 2-socket CPU server system. Samsung also is the first to offer 16GB RDIMMs operating at 1.35 volts, providing around 20 percent savings in power consumption over 1.5V DDR3 solutions.
In addition, the 16GB RDIMM features a dual-die package configuration, which is more efficient in cost and performance over the widely discussed quad-die configuration.